Join Teledyne LeCroy and Professor Eric Bogatin for this series of 30-minute webinars that describe how to design, build, test, measure and debug your assembled printed circuit board.
Part 7: Getting the Lead Out – Expert Soldering Tips
Date: August 8
Time: 2PM Eastern / 11 AM Pacific
In this webinar, Eric provides practical guidance about how to create good solder joints by satisfying the three important conditions for temperature, cleanliness, and solder flux.
Part 8: Understanding On-die Rail Voltages by Measuring Quiet High and Low Signals
Date: September 12
Time: 2PM Eastern / 11 AM Pacific
In this webinar, Eric describes a simple hex inverter circuit and demonstrates how to probe a quiet HIGH or LOW signal in the circuit to “sniff” the power rail voltage (HIGH) or the ground voltage (LOW) on the die.
Part 9: Measuring Crosstalk Between Signal Return Loops
Date: October 10
Time: 2PM Eastern / 11 AM Pacific
In this webinar, Eric demonstrates how two different interconnect approaches (continuous ground plane and adjacent return trace) will affect the amount of crosstalk between an aggressor and victim signal-return path pair.
Part 10: Measuring the Impact of Crosstalk in Ribbon Cables With Different Ground Topologies
Date: November 14
Time: 2PM Eastern / 11 AM Pacific
In this webinar, Eric demonstrates how to measure the ground bounce in a ribbon cable carrying digital signals and how the choice of ground pins in the connector dramatically affects the cross talk.
Part 11: Measure Trace Resistance with a Digital Multimeter (DMM)
Date: December 12
Time: 2PM Eastern / 11 AM Pacific
In this webinar, Eric demonstrates how to use a DMM on a simple two-layer PCB to make both 2-wire and 4-wire resistance measurements and then comparing as measured values to estimates.
Presented by: Eric Bogatin, Teledyne LeCroy Fellow and Professor, ECEE Univ of Colorado, Boulder